LG Chem揭幕了PFAS-和无溶剂的无光成像电,以获得先进的芯片、提高性能和可持续性。 LG Chem unveils PFAS- and solvent-free photo-imageable dielectric for advanced chips, boosting performance and sustainability.

LG Chem开发了用于高级半导体包装的PFAS-和无溶剂液体光成像二电(PID),使高分辨率定型、低温固化,并提高AI和高性能计算芯片的可靠性。 LG Chem has developed a PFAS- and solvent-free liquid photo-imageable dielectric (PID) for advanced semiconductor packaging, enabling high-resolution patterning, low-temperature curing, and improved reliability in AI and high-performance computing chips. 该公司还在推进胶片型PID,与现有制造设备兼容,大型基质的厚度和耐久性一致。 The company is also advancing film-type PID with consistent thickness and durability on large substrates, compatible with existing manufacturing equipment. 以日本的市场支配地位为目标,LG Chem正与全球半导体公司合作,因为下一代芯片对更精细、更稠密的连接的需求不断增长。 Targeting Japan’s market dominance, LG Chem is collaborating with global semiconductor firms as demand grows for finer, denser interconnects in next-generation chips.