Fourier和Schneider电子发射高级液冷数据中心的人工智能解决方案,使高密度、节能计算能够以最少的水使用量进行。 Fourier and Schneider Electric launch advanced liquid-cooled data center solutions for AI, enabling high-density, energy-efficient computing with minimal water use.

Fourier为AI和HPC的工作量启动了一个集装箱式冷板集装箱解决方案,每个集装箱配有无水、直接到芯片冷却和内置冷却器,可交付多达0.5兆瓦的信息技术电源。 Fourier has launched a containerized Cold Plate Container Solution for AI and HPC workloads, delivering up to 0.5 MW of IT power per container with integrated waterless, direct-to-chip cooling and built-in chillers. 该系统能够在没有外部冷却水基础设施的情况下部署插头和插子,支持快速安装,并在缺水或高温地区运作。 The system enables plug-and-play deployment without external chilled-water infrastructure, supports rapid setup, and operates in water-scarce or high-temperature regions. 设计具有N+1冗余性,符合Tier III标准,接近Tier IV的弹性,从单个H100服务器到多兆瓦的校园,并实现低PUE. Designed with N+1 redundancy, it meets Tier III standards with near Tier IV resilience, scales from single H100 servers to multi-megawatt campuses, and achieves low PUE. 同时,Schneider Electric在Motivair品牌下推出一个扩大的液体冷却组合,包括CDUs、热交换器、冷却机和动态冷板,支持每架140千瓦和每架1兆瓦的电密度。 Meanwhile, Schneider Electric unveiled an expanded liquid cooling portfolio under its Motivair brand, including CDUs, heat exchangers, chillers, and dynamic cold plates, supporting power densities over 140kW per rack and up to 1MW per rack. 这些解决方案提供了芯片级冷却,比空气冷却效率高3 000倍,并得到了荷兰航天局的合作和端对端服务的支持。 The solutions offer chip-level cooling up to 3,000 times more efficient than air cooling, backed by NVIDIA collaboration and end-to-end services. 这两项创新旨在利用可扩展、可持续和高效的数据中心基础设施,解决AI公司不断增长的冷却需求。 Both innovations aim to address rising AI cooling demands with scalable, sustainable, and high-efficiency data center infrastructure.