MediaTek 发射3nm Dimensity 9500芯片,配有先进的人工智能、游戏和5G功能,在2025年末推出。 MediaTek launches 3nm Dimensity 9500 chip with advanced AI, gaming, and 5G features, debuting in late 2025 devices.

MediaTek披露了Dimensity 9500, 这部5G智能手机芯片以TSMC的3nm工艺为基础, MediaTek has unveiled the Dimensity 9500, a flagship 5G smartphone chip built on TSMC’s 3nm process, featuring an all-performance-core CPU design with a 4.21GHz ultra core, improved single-core performance, and up to 37% lower peak power draw. 它与ARM Malia-G1 Ultra GPU配对,其性能提高33%,效率提高42%,能够进行120次FPS射线跟踪游戏,并为不真实引擎5.5提供支持。 It pairs with an ARM Mali-G1 Ultra GPU for 33% higher performance and 42% better efficiency, enabling 120FPS ray-traced gaming and support for Unreal Engine 5.5. NPU 990包括一个基因化的人工智能引擎,用于更快、更高效的人工智能装置,包括4K图像生成和始终在使用的小型模型。 The NPU 990 includes a generative AI engine for faster, more efficient on-device AI, including 4K image generation and always-on small models. 芯片支持200MP成像、4K 60fps肖像录像、4lane UFS 4.1储存和5G速度至7.4Gbps的高级连接。 The chip supports 200MP imaging, 4K 60fps portrait video, four-lane UFS 4.1 storage, and advanced connectivity with 5G speeds up to 7.4Gbps. 预计第一批装置将在2025年底使用,可能来自Oppo和Vivo。 First devices are expected in late 2025, likely from Oppo and Vivo.