四家公司在2025年拉斯维加斯的PACK 博览会上展示了智能、可持续包装技术。 Four companies unveil smart, sustainable packaging tech at PACK EXPO 2025 in Las Vegas.

Columbon McKinnon、Epson、Tetra Pak和Hapman将在拉斯维加斯的PACK 2025年博览会上展示先进的包装技术,其特点是自动化、卫生、可持续性和定制方面的创新。 Columbus McKinnon, Epson, Tetra Pak, and Hapman will showcase advanced packaging technologies at PACK EXPO 2025 in Las Vegas, featuring innovations in automation, hygiene, sustainability, and customization. 展览包括高速传输系统、按需贴标签、可持续包装格式和综合加工解决方案,以提高食品、饮料、制药和消费品行业的效率。 Exhibits include high-speed conveyance systems, on-demand labeling, sustainable packaging formats, and integrated processing solutions designed to boost efficiency across food, beverage, pharmaceutical, and consumer goods industries. 参加者可以体验现场演示,探索新设备,了解数字转换、智能包装和环境责任方面的趋势,有机会与整个供应链的专家和网络接触。 Attendees can experience live demos, explore new equipment, and learn about trends in digital transformation, smart packaging, and environmental responsibility, with opportunities to engage with experts and network across the supply chain.