微电子公司在法国开通了60MPLP实验线路,提高了汽车和消费者技术的芯片效率。 STMicroelectronics opens $60M PLP pilot line in France, boosting chip efficiency for automotive and consumer tech.

STMCRO电子公司正在法国Tours启动一条耗资6 000万美元的小组级包装(PLP)试验线,预定在Q3 2026开始运作。 STMicroelectronics is launching a $60 million Panel-Level Packaging (PLP) pilot line in Tours, France, set to begin operations in Q3 2026. 该技术使用大型长方形载体,而不是传统的卷饼,提高制造业效率,降低成本,支持下一代芯片开发。 The technology uses large rectangular carriers instead of traditional wafers, boosting manufacturing efficiency, reducing costs, and supporting next-generation chip development. 该项目在多学科团队和地方研究伙伴的支持下,推进ST的多样化一体化战略,重点是汽车、工业和消费市场的应用。 The project advances ST’s heterogeneous integration strategy, focusing on applications in automotive, industrial, and consumer markets, with support from a multidisciplinary team and local research partners. 这一倡议增强了欧洲的芯片创新能力,并以ST在马来西亚现有的进工党努力为基础。 The initiative enhances Europe’s chip innovation capacity and builds on ST’s existing PLP efforts in Malaysia.