印度在孟加拉鲁发射ARM设计办公室,以开发2nm芯片,推进到2030年成为全球半导体中心的目标。 India launches ARM design office in Bengaluru to develop 2nm chips, advancing its goal to become a global semiconductor hub by 2030.

印度正在推进其半导体雄心壮志, 在班加罗尔开设一个新的ARM设计办公室, India is advancing its semiconductor ambitions with the launch of a new ARM design office in Bengaluru, where 2nm chips for AI, smartphones, and drones will be developed, marking a major step in the country's push to become a global chip design hub. 印度半导体飞行任务使278个机构得以获得先进的设计工具,导致28个芯片设计,吸引了全球公司。 The India Semiconductor Mission has enabled 278 institutions to access advanced design tools, led to 28 chip designs, and attracted global firms. 在Semilcon India 2025年,签署了12项谅解备忘录,并宣布设立一个10亿美元的深技术联盟,以支持半导体和新兴技术。 At Semicon India 2025, 12 MoUs were signed, and a $1 billion Deep Tech Alliance was announced to support semiconductors and emerging technologies. 印度拥有两个业务平台和ISM 2.0计划,以扩大对制造设备和材料的支持,印度的目标是建立一个自力更生的半导体生态系统,到2030年将自己定位为全球市场中的一个关键角色。 With two operational fabs and plans for ISM 2.0 to expand support to manufacturing equipment and materials, India aims to build a self-reliant semiconductor ecosystem and position itself as a key player in the global market by 2030.