MediaTek的下一个旗舰芯片使用TSMC的2nm工艺,定于2026年底生产。 MediaTek's next flagship chip, using TSMC's 2nm process, is set for late 2026 production.

台湾最大的芯片设计商MediaTek已经采用TSMC的2纳米工艺来制造其下一个芯片上的旗舰系统,完成了带式生产阶段,预计到2026年底将开始批量生产. MediaTek, Taiwan's largest chip designer, has adopted TSMC's 2-nanometer process for its next flagship system on a chip, completing the tape-out stage with volume production expected by late 2026. 该芯片是利用TSMC的N2P工艺制造的,该工艺以纳米晶体管为特色,有望在性能和电力效率方面取得重大进展。 The chip, built using TSMC's N2P process featuring nanosheet transistors, promises significant gains in performance and power efficiency. MediaTek与TSMC之间的协作涵盖移动、计算、汽车和数据中心应用,支持全球市场高效解决方案。 The collaboration between MediaTek and TSMC spans mobile, computing, automotive, and data center applications, supporting high-efficiency solutions for global markets.