Lam Research和JSR Corporation在高级芯片制造技术方面的伙伴,结束法律争端。 Lam Research and JSR Corporation partner on advanced chip-making tech, ending legal disputes.

Lam研究公司和JSR公司达成了一项非排他性交叉许可和协作协议,以推动半导体制造,重点是下一代的建模技术,如用于EUV平面印刷的干抗力和用于原子层蚀刻和沉积的材料。 Lam Research and JSR Corporation have formed a non-exclusive cross-licensing and collaboration agreement to advance semiconductor manufacturing, focusing on next-generation patterning technologies like dry resist for EUV lithography and materials for atomic layer etching and deposition. 两家公司将将JSR/Inpria的和片与LAM的蚀刻和沉积技术结合起来,共同开发包括金属氧化,高NAEUV的先进芯片,以及新一代工艺的新材料等创新. The companies will integrate JSR/Inpria’s resists and films with Lam’s etch and deposition technologies, working together on innovations including metal oxide resists, high NA EUV patterning for advanced chips, and new materials for next-gen processes. 伙伴关系还解决各方之间正在进行的诉讼。 The partnership also resolves ongoing litigation between the parties.