Samsung开发了Exynos 2600芯片,并配有新的冷却技术,在银河系统S26上首次启用。 Samsung develops Exynos 2600 chipset with new cooling tech to debut in Galaxy S26.

Samsung正在开发Exynos 2600芯片,使用新的热技术 -- -- 热通屏(HPB) -- -- 一种以铜为基础的热ink,以解决过热问题。 Samsung is developing the Exynos 2600 chipset with new thermal technology called Heat Pass Block (HPB), a copper-based heatsink, to address overheating issues. 芯片使用2nm工艺和扇式瓦费尔级包装,以提高抗热性和性能。 The chip uses a 2nm process and Fan-out Wafer Level Packaging for better heat resistance and performance. 如果到10月的测试成功的话,Exynos 2600可以给2026年初发射的银河S26智能手机供电。 If tests by October are successful, the Exynos 2600 could power the Galaxy S26 smartphones launching in early 2026.