TSMC公司在亚利桑那州投资1 000亿美元,建造对AI技术至关重要的芯片设施。 TSMC invests $100 billion in Arizona, building chip facilities crucial for AI technology.

TSMC生产了全世界90%以上的先进芯片,正在投资1 000亿美元,包括在亚利桑那州建造两个新的先进包装设施。 TSMC, which produces over 90% of the world's advanced chips, is investing $100 billion, including building two new advanced packaging facilities in Arizona. 这一举动至关重要,因为先进的包装技术,如TSMC的CoWos, 能够提高芯片的性能和效率,对于AI应用至关重要。 This move is crucial as advanced packaging technology, like TSMC's CoWoS, enhances chip performance and efficiency, vital for AI applications. 投资提升了美国在与中国的AI竞赛中的地位,并降低了供应链风险。 The investment bolsters the US's position in the AI race with China and reduces supply chain risks.