Soitec和PSMC伙伴开发先进的3D芯片堆叠技术,提高装置效率。 Soitec and PSMC partner to develop advanced 3D chip stacking tech, boosting device efficiency.

Soitec和Powerchip半导体制造公司(PSMC)联手开发超薄晶体转移(TLT)技术,用于先进的3D芯片堆叠。 Soitec and Powerchip Semiconductor Manufacturing Corporation (PSMC) have teamed up to develop ultra-thin Transistor Layer Transfer (TLT) technology for advanced 3D chip stacking. 合作的目的是为智能手机、平板电脑、人工智能系统和自主车辆等装置生产更强大、紧凑和节能的芯片。 This collaboration aims to produce more powerful, compact, and energy-efficient chips for devices like smartphones, tablets, AI systems, and autonomous vehicles. Soitec公司将向PSMC公司提供专门基质,以展示这种新的堆叠技术,标志着半导体设计和效率的显著提高。 Soitec will supply specialized substrates to PSMC for the demonstration of this new stacking technology, marking a significant advancement in semiconductor design and efficiency.