马来西亚的目标是,在面临重大挑战的情况下,到2030年生产高端芯片,以出口2 700亿美元为目标。 Malaysia aims to produce high-end chips by 2030, targeting $270 billion in exports, amid significant challenges.

马来西亚正在推动成为全球半导体工业的主要参与者,在5至7年内生产高端芯片。 Malaysia is pushing to become a major player in the global semiconductor industry by producing high-end chips within five to seven years. 一个关键步骤是与英国的芯片制造者Arm签署一项协议,但专家们警告说,存在人才短缺、资金问题和供应链差距等重大挑战。 A key step was signing a deal with British chip maker Arm, but experts warn of significant challenges like a talent shortage, funding issues, and supply chain gaps. 尽管存在这些障碍,该国力求利用其作为全球10大芯片出口国之一的现有作用,到2030年将其半导体出口增加到2700亿美元。 Despite these hurdles, the country aims to expand its semiconductor exports to $270 billion by 2030, leveraging its existing role as one of the top 10 chip exporters globally.