Siemens Digital披露了TSMC芯片包装技术的自动化工作流程,提高了设计的灵活性。 Siemens Digital unveils automated workflow for TSMC's chip packaging tech, boosting design flexibility.

Siemens Digital为TSMC的InFO包装技术引入了自动化工作流程,目的是向客户提供更多的设计选项。 Siemens Digital has introduced an automated workflow for TSMC's InFO packaging technology, aiming to provide customers with more design options. 工作流程是西门子创新3D IC解决方案的一部分,包括Xpedition包设计软件和其他高级设计工具。 The workflow, part of Siemens' Innovator3D IC solution, includes Xpedition Package Designer software and other advanced design tools. 与技监委的这一合作支持在技监委开放创新平台生态系统内下一代半导体设计。 This collaboration with TSMC supports next-generation semiconductor designs within TSMC's Open Innovation Platform ecosystem.