Nvidia对TSMC的先进芯片包装技术的需求仍然很高,CEO确认。 Nvidia's demand for TSMC's advanced chip packaging tech remains high, CEO confirms.

Nvidia CEO Jensen Huang已经证实,该公司对TSMC的先进包装技术的需求仍然很高,尽管具体的技术需求在不断变化。 Nvidia CEO Jensen Huang has confirmed that the company's demand for TSMC's advanced packaging technology remains high, though the specific technology needs are evolving. 这项澄清是在可能削减订单的问题之后作出的。 This clarification comes following questions about potential order cuts. Nvidia最大的人工智能芯片Blackwell利用TSMC先进的CoWos包装技术将多种芯片整合在一起。 Nvidia's top AI chip, Blackwell, uses TSMC's advanced CoWoS packaging technology to integrate multiple chips.