苹果在新的M5芯片中将CPU和GPU分离出来,以获得更好的性能,定于2025-2026年发行。 Apple separates CPU and GPU in new M5 chips for better performance, set for 2025-2026 release.

苹果公司计划在其即将推出的M5 Pro、M5 Max和M5 Ultra处理器中将CPU和GPU核心分离,使用TSMC的先进的N3P技术和SoIC-mH包装,以提高热性能和产量。 Apple plans to separate CPU and GPU cores in its upcoming M5 Pro, M5 Max, and M5 Ultra processors, using TSMC's advanced N3P technology and SoIC-mH packaging for better thermal performance and production yields. M5Pro和M5 Max的批量生产预计将在2025年底进行,而M5 Ultra将于2026年进行。 Mass production for the M5 Pro and M5 Max is expected in late 2025, while the M5 Ultra will come in 2026. 这一变化旨在改进目前的单单位芯片设计,并可用于苹果公司私人云计算技术。 This change aims to improve the current single-unit chip design and could be used in Apple's Private Cloud Compute technology.