Hitachi发射新的DCR Etch系统9060,用于精确的 3D 半导体制造。 Hitachi launches new DCR Etch System 9060 for precise 3D semiconductor manufacturing.
Hitachi高科技公司引进了DCR Etch系统9060系列,用于在原子一级对先进的3D半导体装置进行精确的异向蚀刻。 Hitachi High-Tech Corporation has introduced the DCR Etch System 9060 Series, designed for precise isotropic etching of advanced 3D semiconductor devices at the atomic level. 该系统利用等离子蚀刻技术实现低损坏、高精度的结果,并包括一种独特的冷却机制,以提高效率。 This system uses plasma etching technology for low-damage, high-precision results, and includes a unique cooling mechanism to enhance efficiency. 它旨在帮助复杂的半导体制造商降低成本和提高生产力。 It aims to help manufacturers of complex semiconductors reduce costs and improve productivity.