Samsung计划到2027年12月将一家旧的液晶化管厂转换为HBM芯片容器设施。 Samsung plans to convert an old LCD plant into HBM chip packaging facilities by December 2027.

Samsung电子公司计划扩大其在南钟川省的半导体设施,将一家旧液晶化管厂改造成一个先进的HBM芯片包装工地。 Samsung Electronics plans to expand its semiconductor facilities in South Chungcheong Province, converting an old LCD plant into a site for advanced HBM chip packaging. 这些新设施将于2027年12月完成,将推动对AI计算至关重要的HBM生产,帮助三星在全球半导体市场上与竞争对手SK hynix竞争。 Set to be completed by December 2027, the new facilities will boost HBM production, crucial for AI computing, helping Samsung compete with rival SK hynix in the global semiconductor market.