Nvidia解决了Blackwell AI芯片设计缺陷,在TSMC的支持下推迟释放到Q4。 Nvidia resolves Blackwell AI chip design flaw, delaying release to Q4 with TSMC support.

Nvidia CEO Jensen Huang 宣布公司Blackwell AI芯片的设计缺陷 已经在制造伙伴TSMC的帮助下解决了 Nvidia CEO Jensen Huang announced that a design flaw in the company's Blackwell AI chips has been resolved with help from manufacturing partner TSMC. 这种缺陷造成生产延误,影响到谷歌和微软等客户。 The flaw caused production delays, impacting clients like Google and Microsoft. 最初设定第二季度释放,现在预计芯片将在第四季度投入使用。 Initially set for a second-quarter release, the chips are now expected to ship in the fourth quarter. 黄四郎强调,问题在于Nvidia的过错,但认为TSMC的支持对于克服挫折至关重要。 Huang emphasized that the issue was Nvidia's fault but maintained that TSMC's support was crucial in overcoming the setback.