美国商务部对HP公司Corvallis的半导体技术扩展和现代化设施投资5 000万美元。 U.S. Commerce Department invests $50M in HP Inc.'s Corvallis facility for semiconductor technology expansion and modernization.

美国商务部正在对惠普公司投资5 000万美元,以扩大俄勒冈州Corvallis设施并使之现代化,支持半导体技术的生产和开发。 The U.S. Commerce Department is investing $50M in HP Inc. to expand and modernize its Corvallis, Oregon facility, supporting the production and development of semiconductor technologies. 这符合2022年8月国会批准的美国半导体制造业39B补贴方案。 This aligns with the $39B subsidy program for U.S. semiconductor manufacturing, approved by Congress in August 2022. 这笔资金将促进生命科学仪器和AI技术硬件的发展,并支持在药物发现和细胞线开发方面为实验室设备制造硅装置。 The funding will boost life sciences instrumentation and AI technology hardware, as well as support the manufacturing of silicon devices for lab equipment in drug discovery and cell line development.