荣耀Magic V3可折叠智能手机,配备龙8代3芯片组,将于9月5日在柏林国际博览会上全球发布. Honor Magic V3 foldable smartphone, featuring Snapdragon 8 Gen 3 chipset, launches globally on September 5 during IFA in Berlin.

9月5日,在柏林的IFA期间,Honor Magic V3智能手机将在全球范围内推出。 The Honor Magic V3 smartphone, a slim and lightweight foldable, will globally launch on September 5 during IFA in Berlin. 该设备具有5150mAh的电池,龙8代3芯片组和12.3英寸的144Hz的OLED显示屏. The device features a 5,150mAh battery, Snapdragon 8 Gen 3 chipset, and a 12.3-inch 144Hz OLED display. 另外还将推出荣耀MagicPad 2平板电脑和荣耀MagicBook Art 14笔记本电脑, 提供与三星和谷歌可折叠设备的竞争力. It will be joined by the Honor MagicPad 2 tablet and Honor MagicBook Art 14 laptop, offering a competitive alternative to Samsung and Google foldable devices.