台积电计划在德国建设其第一家欧洲晶圆厂，该项目由台积电与罗伯特·博世、英飞凌、恩智浦和 ESMC 联合开展，预计 2027 年投入生产。 TSMC plans to construct its first European fab in Germany, a joint project with Robert Bosch, Infineon, NXP, and ESMC, with production expected by 2027.
台湾半导体制造公司（TSMC）计划下个月在德国德累斯顿开始建造其首家欧洲晶圆厂，预计 2027 年投入生产。 Taiwan Semiconductor Manufacturing Company (TSMC) plans to start construction of its first European fab in Dresden, Germany next month, with production expected by 2027. 该项目名为欧洲半导体制造公司（ESMC），是一家合资企业，由罗伯特·博世有限公司、英飞凌科技股份公司和恩智浦半导体公司持有少数股权，台积电持有 70% 的股权。 The project, known as European Semiconductor Manufacturing Company (ESMC), is a joint venture with minority stakes held by Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors NV, and TSMC holding a 70% stake. 该工厂的月生产能力预计将达到 40,000 片 300 毫米晶圆。 The facility's monthly production capacity is set to reach 40,000 300mm wafers.