CEA-Leti 的研究人员开发了用于 AI 嵌入式图像传感器的三晶圆堆叠技术。 CEA-Leti researchers developed triple-wafer stacking tech for AI-embedded image sensors.

CEA-Leti 的研究人员开发了一种用于嵌入式 AI 图像传感器的三晶圆堆叠技术。 CEA-Leti researchers developed a triple-wafer stacking technology for image sensors with embedded AI. 该技术采用混合键合和硅通孔，使传感器能够记录、解释和处理场景。 This technology, using hybrid bonding and through-silicon vias, allows sensors to record, interpret, and act on scenes. 它为具有边缘 AI 功能的全功能三层智能 CMOS 图像传感器铺平了道路，有可能在不增加尺寸的情况下提高智能手机、相机、汽车和医疗设备中的传感器性能。 It paves the way for a fully functional three-layer smart CMOS image sensor with edge AI capabilities, potentially improving sensor performance in smartphones, cameras, automobiles, and medical devices without increasing size.