3 款 Pixel 机型（Pixel 9、Pixel 9 Pro、Pixel 9 Pro XL）采用平边设计、升级的 AI 和 Tensor G4 芯片组，预计将于 10 月上市。 3 Pixel models (Pixel 9, Pixel 9 Pro, Pixel 9 Pro XL) with flat-edge design, upgraded AI, and Tensor G4 chipset expected in October.

手机壳制造商 Thinborne 泄露的 Pixel 9 手机壳表明，谷歌今年正在研发三款 Pixel 机型，包括标准版 Pixel 9、Pixel 9 Pro 和更大的 Pixel 9 Pro XL 版本。 Leaked Pixel 9 cases from case-maker Thinborne suggest Google is working on three Pixel models this year, including the standard Pixel 9, Pixel 9 Pro, and a larger Pixel 9 Pro XL variant. 这些外壳还采用了平边设计、升级的 AI 功能和新的 Tensor G4 芯片组。 The cases also indicate a flat-edge design, upgraded AI features, and a new Tensor G4 chipset. 谷歌预计将于 10 月发布这些设备，并可能在 2024 年 Google I/O 大会上正式亮相。 Google is expected to release the devices in October, with an official unveiling potentially happening at Google I/O 2024.