SK海力士与台积电建立战略合作伙伴关系，共同开发第六代HBM4芯片，并于2026年实现量产。 SK hynix and TSMC form strategic partnership to develop 6th-gen HBM4 chips for mass production in 2026.
韩国芯片制造商 SK 海力士与台湾半导体制造公司 (TSMC) 建立战略合作伙伴关系，共同开发下一代高带宽存储器 (HBM) 芯片和先进的封装技术。 South Korean chipmaker SK hynix and Taiwan Semiconductor Manufacturing Company (TSMC) have formed a strategic partnership to develop next-generation High Bandwidth Memory (HBM) chips and advanced packaging technologies. 此次合作旨在推动 HBM 技术的创新并实现内存性能的突破。 The partnership aims to drive innovation in HBM technology and enable breakthroughs in memory performance. SK海力士与台积电计划合作开发第六代HBM4芯片，预计于2026年量产。 SK hynix and TSMC plan to collaborate in developing sixth-generation HBM4 chips, scheduled for mass production in 2026. 这两家公司都是 Nvidia 的主要客户，Nvidia 凭借其图形处理单元是人工智能 (AI) 半导体市场的主要参与者。 Both companies are key customers of Nvidia, a major player in the artificial intelligence (AI) semiconductor market with its graphics processing units.