联合首席执行官 Kye-Hyun Kyung 表示，三星先进芯片封装业务预计 2021 年收入将超过 1 亿美元。 Samsung's advanced chip packaging business anticipates $100M+ revenue in 2021, as stated by co-CEO Kye-Hyun Kyung.
三星电子联合首席执行官 Kye-Hyun Kyung 表示，其先进芯片封装业务预计今年将产生 1 亿美元或更多的收入。 Samsung Electronics' advanced chip packaging business is projected to generate $100 million or more in revenue this year, according to co-CEO Kye-Hyun Kyung. 三星去年将先进芯片封装作为一个业务部门，预计投资成果将在 2021 年下半年显现。 Samsung established the advanced chip packaging as a business unit last year and expects investment results to emerge in the second half of 2021. 该信息是在公司年度股东大会上分享的。 This information was shared during the company's annual general shareholders' meeting.