高通于 3 月 18 日推出 Snapdragon 8s Gen 3 芯片组，为手机制造商提供更实惠的选择。 Qualcomm launches Snapdragon 8s Gen 3 chipset on March 18, offering a more affordable option for phone manufacturers.
高通将于 3 月 18 日推出 Snapdragon 8s Gen 3 芯片组，为手机制造商提供更实惠的选择，同时保留关键功能。 Qualcomm is set to launch the Snapdragon 8s Gen 3 chipset on March 18, offering a more affordable option for phone manufacturers while retaining key features. 该芯片组预计将采用运行频率为 3.01GHz 的 Cortex-X4 prime 核心，预计比其前身 Snapdragon 8s Gen 2 更快，但比当前旗舰产品 Snapdragon 8 Gen 3 慢。 Expected to feature a Cortex-X4 prime core running at 3.01GHz, the chipset is anticipated to be faster than its predecessor, the Snapdragon 8s Gen 2, but slower than the current flagship Snapdragon 8 Gen 3. 该芯片组预计将帮助手机制造商保持有竞争力的价格，同时保留利润。 The chipset is expected to help phone makers maintain competitive pricing while retaining their margins.